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ZXMP4A16G
PACKAGE OUTLINE
PACKAGE DIMENSIONS
PAD LAYOUT DETAILS
DIM
Millimetres
Min Max
Inches
Min Max
DIM
Millimetres
Min Max
Inches
Min Max
A
A1
-
0.02
1.80
0.10
-
0.0008
0.071
0.004
e
e1
2.30 BSC
4.60 BSC
0.0905 BSC
0.181 BSC
b
b2
C
0.66
2.90
0.23
0.84
3.10
0.33
0.026
0.114
0.009
0.033
0.122
0.013
E
E1
L
6.70
3.30
0.90
7.30
3.70
-
0.264
0.130
0.0355
0.287
0.146
-
D
6.30
6.70
0.248
0.264
? Zetex plc 2003
Europe
Americas
Asia Pacific
Zetex plc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
Zetex GmbH
Streitfeldstra?e 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road
Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to
ISSUE 4 - JULY 2003
www.zetex.com
7
SEMICONDUCTORS
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